Hardware

The use of artificial intelligence (AI) systems, such as the models underpinning the functioning of ChatGPT and various other online platforms, has grown exponentially over the past few years. Current hardware and electronic devices, however, […]

The ubiquity of smart devices—not just phones and watches, but lights, refrigerators, doorbells and more, all constantly recording and transmitting data—is creating massive volumes of digital information that drain energy and slow data transmission speeds. […]

A new chip aims to dramatically reduce energy consumption while accelerating the processing of large amounts of data.This post was originally published on this site.

In a Nature Communications study, researchers from China have developed an error-aware probabilistic update (EaPU) method that aligns memristor hardware’s noisy updates with neural network training, slashing energy use by nearly six orders of magnitude […]

Optical computing has emerged as a powerful approach for high-speed and energy-efficient information processing. Diffractive optical networks, in particular, enable large-scale parallel computation through the use of passive structured phase masks and the propagation of […]

Until now, AI services based on large language models (LLMs) have mostly relied on expensive data center GPUs. This has resulted in high operational costs and created a significant barrier to entry for utilizing AI […]

An ultrathin ferroelectric capacitor, designed by researchers from Japan, demonstrates strong electric polarization despite being just 30 nm thick including top and bottom electrodes—making it suitable for high-density electronics. Using a scandium-doped aluminum nitride film […]

Scientists in China have unveiled a new AI chip called LightGen that is 100 times faster and 100 times more energy efficient than NVIDIA chips, the leading supplier of AI chips worldwide. Instead of using […]

A cross-institutional team led by researchers from the Department of Electrical and Electronic Engineering (EEE), under the Faculty of Engineering at The University of Hong Kong (HKU), have achieved a major breakthrough in the field […]

A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring and order-of-magnitude speed gains.This post was originally published on this site.