An ultrathin ferroelectric capacitor, designed by researchers from Japan, demonstrates strong electric polarization despite being just 30 nm thick including top and bottom electrodes—making it suitable for high-density electronics. Using a scandium-doped aluminum nitride film […]
Scientists in China have unveiled a new AI chip called LightGen that is 100 times faster and 100 times more energy efficient than NVIDIA chips, the leading supplier of AI chips worldwide. Instead of using […]
Free-space optical communications (FSOC), which use lasers for data transmission, are a promising approach for achieving high-speed links between aircraft, spacecraft, and ground stations. However, achieving 360-degree coverage requires multiple articulated terminals installed on the […]
A team of researchers from Universidad Carlos III de Madrid (UC3M) and Universidad Politécnica de Madrid (UPM) has developed an innovative algorithm for Wi‑Fi networks called “Ponte” that can provide communication in industrial environments with […]
A research team at the University of Ottawa has developed an advanced artificial intelligence system designed to autonomously defend wireless networks from jamming attacks, operating much like a digital immune system. This technology can automatically […]
A cross-institutional team led by researchers from the Department of Electrical and Electronic Engineering (EEE), under the Faculty of Engineering at The University of Hong Kong (HKU), have achieved a major breakthrough in the field […]
Between 2016 and 2024 there were 193 internet shutdowns imposed in 41 African countries. This form of social control is a growing trend in the continent, according to a new open-access source book. It has […]
The National Institute of Information and Communications Technology (NICT) has successfully demonstrated 2 Tbit/s Free-Space Optical (FSO) communication using small optical communication terminals that can be mounted on satellites and HAPS, marking a world first […]
A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring and order-of-magnitude speed gains.This post was originally published on this site.
MIT researchers have developed a new fabrication method that could enable the production of more energy efficient electronics by stacking multiple functional components on top of one existing circuit.This post was originally published on this […]
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